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Cu/ CuMn/ CuAl/Anodes
Material composition: Cu, CuMn, CuAl Target
Mateallic purity: 99.99999%
Bonding type: monolithic or BP Bonded.
IPAS® Technology，grain size ≤1 μm；Normal pressing and rolling, grain size ≤30 μm
{110} group，40% quantity crystals, less particles
Customized holes and locations， precise machining
Vaccum packing, shelf life duration 6 month
GDMS， EBSD provided
CONTACT US
Contact：Rita Zhu
Telephone：13436931560
Wechat/WhatsApp: 13436931560
Email： rita@cowinsemicon.com
Address: No.22 Boxuan Rd, Hangzhou Bay, Ningbo City, Zhejiang Province, China.
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